PIPages
Labs

Jivtesh Garg

University of Oklahoma, OK·Engineering

Electronics such as laptops, phones and high-power gallium nitride (GaN) transistors produce more heat as they become more powerful. If that heat is not removed, devices become hot enough to fail.

Fields

Engineering

Materials Science

Physics

Topics

thermal management

interfacial thermal conductance

thermal boundary resistance

Grants
1 known grant, through Dec 2026

What they work on

  1. Test whether evanescent electric fields across 2–4 Å interfacial gaps help acoustic phonons, the lattice vibrations that carry heat, cross GaN–diamond interfaces, using atomistic Green's function calculations.
  2. Quantify how Coulomb-interaction-assisted phonon transmission raises interfacial thermal conductance, using classical and ab initio molecular dynamics simulations of defected device–substrate interfaces.
  3. Identify materials with higher thermal conductivity than diamond at nanometer-to-micron length scales, using first-principles three- and four-phonon scattering calculations and an exact solution of the Boltzmann transport equation.

More about the research

Diamond conducts heat extremely well, at more than 2000 W/mK at room temperature, so it makes an attractive base layer for spreading heat away from devices. However, the junction between GaN and diamond has weak bonding and structural defects. These flaws block much of the heat flow and weaken the benefit of using diamond. This project asks whether electric fields across that interface can help heat cross it.

Why it matters

Overheating limits the reliability and performance of high-power gallium nitride devices used in power and radio-frequency electronics. Lowering the thermal resistance at the GaN–diamond junction, and finding materials that conduct heat even better than diamond, could lead to cooler and more reliable next-generation devices for chip and device makers.

Known grants

From NIH and NSF research grants. Labs often have other funding we can't see.

Enhancement of interfacial thermal transport through evanescent electric field mediated acoustic phonon transmission for efficient cooling of high power Gallium Nitride devices

NSF · Jan 2024 – Dec 2026

Closest labs

Xianfan Xu

Purdue University, IN·Engineering

Develop theory for how radiative heat transport by hyperbolic phonon polaritons, light-lattice vibration waves, inside hyperbolic materials depends on wavelength and temperature.

Asegun Henry

Massachusetts Institute of Technology, MA·Engineering

Advance understanding of phonon transport, the atomic vibrations that carry heat, in disordered materials whose atoms lack a regular repeating arrangement, using advanced computational approaches.

Yan Wang

University of Nevada-Reno, NV·Engineering·Early-career

Determine how wave-like phonons, atomic vibrations that carry heat, travel, scatter and become trapped in periodic, quasi-periodic and aperiodic structures, combining spectral phonon analysis with phonon spectroscopy.

The school

University of Oklahoma: 11 labs on PI Pages, $474M a year on research, 225 research doctorates a year.

More about University of Oklahoma

Reach out

A start for your email. Fill in the brackets.